Sreekala, L.; Dey, P.; Hickel, T.; Neugebauer, J.: Unveiling nonmonotonic chemical trends in the solubility of H in complex Fe–Cr–Mn carbides by means of ab initio based approaches. Physical Review Materials 6 (1), 014403 (2022)
Hickel, T.; McEniry, E.; Nazarov, R.; Dey, P.: Ab initio basierte Simulation zur Wasserstoffversprödung in hoch-Mn Stählen. Seminar der Staatlichen Materialprüfungsanstalt Darmstadt, Institut für Werkstoffkunde, Darmstadt, Germany (2020)
Dey, P.: Materials design based on ab initio methods: Coherent microstructure & its impact on real application. Seminar at TU Delft, Delft, The Netherlands (2018)
Dey, P.; Yao, M.; Friák, M.; Hickel, T.; Raabe, D.; Neugebauer, J.: Ab-initio investigation of the role of kappa carbide in upgrading Fe–Mn–Al–C alloy to the class of advanced high-strength steels. ArcelorMittal Global R&D Gent, Thessaloniki, Greece (2017)
Dey, P.: Ab initio investigation of the interaction of hydrogen with carbides in advanced high-strength steels. Seminar at Southern University of Science and Technology, Shenzhen, China (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…