Dehm, G.: New Insights into Materials Phenomena by Advanced TEM. Symposium: Advanced Materials Analysis by latest STEM Technologies, Mülheim an der Ruhr, Germany (2015)
Brinckmann, S.; Fink, C.; Dehm, G.: Roughness and Microstructure Development during Nanotribology in Austenite. DPG-Spring Meeting, Berlin, Germany (2015)
Dehm, G.: Probing deformation mechanisms of Cu structures relevant for electronic applications. Electronic Materials and Applications, Orlando, FL, USA (2015)
Dehm, G.: Phase stability in nanostructured metallic materials with exceptional strength. 2015 MRS Fall Meeting, Symposium VV: In situ study of synthesis and transformation of materials, Boston, MA, USA (2015)
Harzer, T. P.; Djaziri, S.; Raghavan, R.; Dehm, G.: Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy. 61. Metallkunde-Kolloquium - Werkstoffforschung für Wirtschaft und Gesellschaft, Lech am Arlberg, Austria (2015)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Probing deformation and fracture of materials with high spatial resolution. EDSA 2015 – International Workshop on Stress Assisted Environmental Damage in Structural Materials, Chennai, India (2015)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Are micro-fracture tests reliable? 2015 MRS Fall Meeting and Exhibit - Symposium T: Strength and Failure at the Micro and Nano-scale-From fundamentals to Applications
, Boston, MA, USA (2015)
Dehm, G.: Differences in deformation behavior of Cu structures containing individual grain boundaries. Symposium RR: Scaling Effects in Plasticity - Synergy between Simulations and Experiments, Fall MRS, Boston, MA, USA (2014)
Hodnik, N.; Baldizzone, C.; Jeyabharathi, C.; Dehm, G.; Mayrhofer, K. J. J.: Bridging the gap between electrochemistry and microscopy: electrochemical IL-TEM and in-situ electrochemical TEM study. 2nd Conference on in In-situ and Correlative Electron Microscopy, Saarbrücken, Germany (2014)
Marx, V. M.; Cordill, M. J.; Kirchlechner, C.; Dehm, G.: In-situ stress measurements in thin films using synchrotron diffraction. Summer School: Theory and Practice of Modern Powder Diffraction, Tagungshaus Schönenberg, Ellwangen, Ellwangen, Germany (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Design and development of fracture property measurement techniques at the small scale. ICAMS (RUB), Bochum, Germany (2014)
Marx, V. M.; Kirchlechner, C.; Berger, J.; Cordill, M. J.; Dehm, G.: In-situ stress measurements in Cu films using synchrotron radiation. "Mechanical Issues for Flexible Electronics" Flex Workshop, Erich Schmid Institut, Leoben, Leoben, Austria (2014)
Dehm, G.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. Schöntal Symposium - Dislocation-based Plasticity, Kloster Schöntal, Germany (2014)
Dehm, G.; Imrich, P. J.; Wimmer, A. C.; Kirchlechner, C.: From idealized bi-crystals towards applied polycrystals: Plastic deformation in small dimensions. TMS2014, 143rd Annual Meeting & Exhibition, San Diego, CA, USA (2014)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…