Frank, A.; Dias, M.; Hieke, S. W.; Kruth, A.; Scheu, C.: Spontaneous fluctuations in a plasma ion assisted deposition – correlation between deposition conditions and vanadium oxide thin film growth. Thin Solid Films 722, 138574 (2021)
Frank, A.; Wochnik, A. S.; Bein, T.; Scheu, C.: A biomolecule-assisted, cost-efficient route for growing tunable CuInS2 films for green energy application. RSC Advances 7 (33), pp. 20219 - 20230 (2017)
Hettstedt, C.; Frank, A.; Karaghiosoff, K.: Synthesis of two p-methoxyphenyl substituted phosphines. Phosphorus, Sulfur, and Silicon and the Related Elements 191 (10), pp. 1297 - 1301 (2016)
Frank, A.; Changizi, R.; Scheu, C.: Preparative and analytical challenges in electron microscopic investigation of nanostructured CuInS2 thin films for energy applications. Microscience Microscopy Congress (MMC) 2019, Manchester, UK (2019)
Gänsler, T.; Frank, A.; Betzler, S. B.; Scheu, C.: Electron microscopy studies of Nb3O7(OH) nanostructured cubes - insights in the growth mechanism. Microscience Microscopy Congress MMC2019, Manchester, UK (2019)
Frank, A.; Dias, M.; Hieke, S. W.; Kruth, A.; Scheu, C.: Electron microscopic investigation of the influence of plasma parameters on VOx films deposited by a plasma ion assisted process. E-MRS 2019 Spring Meeting, Nice, France (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…