Heinz, W.; Pippan, R.; Dehm, G.: Investigation of the fatigue behavior of Al thin films with different microstructure. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 527 (29-30), pp. 7757 - 7763 (2010)
Fischer, F. D.; Cha, L.; Dehm, G.; Clemens, H. J.: Can local hot spots induce α2/γ lamellae during incomplete massive transformation of γ-TiAl alloys? Intermetallics 18 (5), pp. 972 - 976 (2010)
Fischer , F. D.; Waitz, T.; Scheu, C.; Cha, L.; Dehm, G.: Study of nanometer-scaled lamellar microstructure in a Ti–45Al–7.5Nb alloy – Experiments and modeling. Intermetallics 18 (4), pp. 509 - 517 (2010)
Matoy, K.; Detzel, T.; Müller , M.; Motz, C.; Dehm, G.: Interface fracture properties of thin films studied by using the micro-cantilever deflection technique. Surface and Coatings Technology 204 (6-7), pp. 878 - 881 (2009)
Dehm, G.: Miniaturized single-crystalline fcc metals deformed in tension: New insights in size-dependent plasticity. Progress in Materials Science 54 (6), pp. 664 - 688 (2009)
Oh, S. H.; Legros, M.; Kiener, D.; Dehm, G.: In situ observation of dislocation nucleation and escape in a submicrometre aluminium single crystal. Nature Materials 8 (2), pp. 95 - 100 (2009)
Kiener, D.; Motz, C.; Dehm, G.; Pippan, R.: Overview on established and novel FIB based miniaturized mechanical testing using in-situ SEM. International Journal of Materials Research 100 (8), pp. 1074 - 1087 (2009)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.