Hieke, S. W.; Dehm, G.; Scheu, C.: Temperature induced faceted hole formation in epitaxial Al thin films on sapphire. 8th International Conference on High Temperature Capillarity (HTC-2015), Bad Herrenalb, Germany (2015)
Folger, A.; Wisnet, A.; Scheu, C.: Transmission electron microscopic characterization of TiO2/NbxOy core-shell nanowires. Autumn School on Microstructural Characterization and Modelling of Thin-Film Solar Cells, Werder, Germany (2014)
Frank, A.; Wochnik, A. S.; Betzler, S. B.; Scheu, C.: Copper indium disulfide films synthesized with L-cysteine. Autumn School on Microstructural Characterization and Modelling of Thin-Film Solar Cells, Werder, Potsdam, Germany (2014)
Hieke, S. W.; Dehm, G.; Scheu, C.: Solid state dewetting phenomena of epitaxial Al thin films on sapphire (α-Al2O3). 2nd International Multidisplinary Microscopy Congress (InterM 2014), Oludeniz, Fethiye, Turkey (2014)
Gleich, S.; Heinzl, C.; Ossiander, T.; Perchthaler, M.; Scheu, C.: Investigation of high-temperature polymer electrolyte membrane fuel cells by electron microscopy methods. CENS Workshop “Nanosciences: Great Adventures on Small Scales”, Venice, Italy (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project aims to investigate the dynamic hardness of B2-iron aluminides at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1 and study the microstructure evolution across strain rate range.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.