Chen, T.; Lu, W.; Li, J.; Chen, S.; Li, C.; Weng, G. J.: Tailoring tensile ductility of thin film by grain size graded substrates. International Journal of Solids and Structures 166, pp. 124 - 134 (2019)
Liu, C.; Lu, W.; Weng, G. J.; Li, J.: A cooperative nano-grain rotation and grain-boundary migration mechanism for enhanced dislocation emission and tensile ductility in nanocrystalline materials. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 756, pp. 284 - 290 (2019)
Li, J.; Weng, G. J.; Chen, S.; Wu, X.: On strain hardening mechanism in gradient nanostructures. International Journal of Plasticity 88, pp. 89 - 107 (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.