Brink, T.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Atomistic Modeling of the Thermodynamics of Grain Boundaries in fcc Metals. 19th International Conference on Diffusion in Solids and Liquids, Crete, Greece (2023)
Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research
Society
, Virtual (2021)
Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Congruent grain boundary phase transformations revealed by STEM in pure copper. Microscopy conference Joint Meeting of Dreiländertagungn & Multinational Congress on Microscopy MC 2021, virtual, Vienna, Austria (2021)
Liebscher, C.: How do grain boundaries transform in metallic alloys? Institute of Material Physics, Westfälische Wilhelms-Universität Münster, Online Colloqium, Münster, Germany (2021)
Liebscher, C.; Lu, W.; Dehm, G.; Raabe, D.; Li, Z.: Complex phase transformation pathways in high entropy alloys explored by in situ S/TEM. Third International Conference on High Entropy Materials, Berlin, Germany (2020)
Ahmad, S.; Liebscher, C.; Dehm, G.: To decipher the novel atomic structure of [111] tilt grain boundaries in Al. Material Science and Engineering Congress - MSE 2020, virtual, Darmstadt, Germany (2020)
Devulapalli, V.; Dehm, G.; Liebscher, C.: Unravelling grain boundary structures in Ti thin films using aberration-corrected transmission electron microscopy. MSE Darmdtadt (Virtual), Darmstadt, Germany (2020)
Saood, S.; Liebscher, C.; Dehm, G.: Observing the atomic structure of high angle [111] tilt grain boundaries in Al. Materials Science and Engineering Congress MSE 2020, virtual (2020)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.