Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)
Harzer, T. P.; Dehm, G.: Microstructural studies of Cu–Cr thin film structures grown by molecular beam epitaxy using advanced transmission electron microscopy. Macan Theromodynamics Workshop, Istanbul, Turkey (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Eiper, E.; Martinschitz, K. J.; Dehm, G.; Kečkéš, J.: Size effect in metallic thin films characterized by low-temperature X-ray diffraction. Gordon Research Conference on thin film & smallscale mechanical behavior , Colby College Waterville, Maine, USA (2006)
Rester, M.; Kiener, D.; Kreuzer, H. G.M.; Dehm, G.; Motz, C.: Microstructural investigation of the deformation zone below nanoindents in copper, silver and nickel. Hysitron Workshop and Usermeeting, München, Germany (2006)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.