Schneider, P.; Sigel, R.; Lange, M. M.; Beier, F.; Renner, F. U.; Erbe, A.: Activation and fluoride-assisted phosphating of aluminium silicon coated steel. ACS Applied Materials and Interfaces 5 (10), pp. 4224 - 4232 (2013)
Kawano, T.; Renner, F. U.: Studies on Wetting Behaviour of Hot-dip Galvanizing Process by use of Model Specimens with Tailored Surface Oxides. Surf. Int. Anal. 44 (8), pp. 1009 - 1012 (2012)
Kawano, T.; Renner, F. U.: Tailoring Model Surface and Wetting Experiment for a Fundamental Understanding of Hot-dip Galvanizing. ISIJ International 51, 10, pp. 1703 - 1709 (2011)
Valtiner, M.; Ankah, G. N.; Bashir, A.; Renner, F. U.: Atomic force microscope imaging and force measurements at electrified and actively corroding interfaces: Challenges and novel cell design. Review of Scientific Instruments 82 (2), pp. 023703-1 - 023703-8 (2011)
Naraparaju, R.; Christ, H.-J.; Renner, F. U.; Kostka, A.: Effect of shot-peening on the oxidation behaviour of boiler steels. Oxidation of Metals 76 (3-4), pp. 233 - 245 (2011)
Borissov, D.; Pareek, A.; Renner, F. U.; Rohwerder, M.: Electrodeposition of Zn and Au–Zn alloys at low temperature in an ionic liquid. Physical Chemistry Chemical Physics 12 (9), pp. 2059 - 2062 (2010)
Gründer, Y.; Renner, F. U.; Lee,, T. L.: The electrodeposition of copper onto UHV-prepared GaAs(001) surfaces. Surface Science 603 (17), pp. L105 - L108 (2009)
Naraparaju, R.; Christ, H.-J.; Renner, F. U.; Kostka, A.: Dislocation Engineering and its effect on the oxidation behaviour. Materials at High Temperatures 29, pp. 116 - 122 (2012)
Duarte, M. J.; Brinckmann, S.; Renner, F. U.; Dehm, G.: Nanomechanical testing under environmental conditins of Fe-based metallic glasses. 22st International Symposium on Metastable Amorphous and Nanostructured Materials, ISMANAM 2015, Paris, France (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.