Mayweg, D.: Microstructural characterization of white etching cracks in 100Cr6 bearing steel with emphasis on the role of carbon. Dissertation, RWTH Aachen University (2021)
Dutta, A.: Deformation behaviour and texture memory effect of multiphase nano-laminate medium manganese steels. Dissertation, RWTH Aachen University (2019)
Archie, F. M. F.: Microstructural influence on micro-damage initiation in ferritic-martensitic DP-steels. Dissertation, RWTH Aachen, Aachen, Germany (2018)
Archie, F. M. F.: Damage nucleation in DP-steels: experimental characterization of the contributing microstructural parameters. Dissertation, Fakultät für Georessourcen und Materialtechnik, RWTH Aachen (2018)
Elhami, N. N.: Influence of strain path changes during cup drawing on the twinning activity in TWIP steels investigated by ECCI. Dissertation, RWTH Aachen, Aachen, Germany (2017)
Stechmann, G.: A Study on the Microstructure Formation Mechanisms and Functional Properties of CdTe Thin Film Solar Cells Using Correlative Electron Microscopy and Atomistic Simulations. Dissertation, RWTH Aachen, Aachen, Germany (2017)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…