Rechmann, J.; Krzywiecki, M.; Erbe, A.: Carbon-Sulfur Bond Cleavage During Adsorption of Octadecane Thiol to Copper in Ethanol. Langmuir 35 (21), pp. 6888 - 6897 (2019)
Krzywiecki, M.; Grządziel, L.; Powroźnik, P.; Kwoka, M.; Rechmann, J.; Erbe, A.: Oxide – organic heterostructures: a case study of charge displacement absence at a SnO2 – copper phthalocyanine buried interface. Physical Chemistry Chemical Physics 20 (23), pp. 16092 - 16101 (2018)
Mondragón Ochooa, J. S.; Altin, A.; Rechmann, J.; Erbe, A.: Delamination Kinetics of Thin Film Poly(acrylate) Model Coatings Prepared by Surface Initiated Atom Transfer Radical Polymerization on Iron. Journal of the Electrochemical Society 165 (16), pp. C991 - C998 (2018)
Panther, J.; Rechmann, J.; Müller, T. J. J.: Fischer indole synthesis of 3-benzyl-1H-indole via conductive and dielectric heating. Chemistry of Heterocyclic Compounds 52 (11) (2016)
Rabe, M.; Rechmann, J.; Boyle, A. L.; Erbe, A.: Designing Electro Responsive Self-Assembled Monolayers Based on the Coiled-Coil Peptide Binding Motif. 17th International Conference on Organized Molecular Films” (ICOMF17), New York, NY, USA (2018)
Rechmann, J.: Electron transfer characteristics of gold and oxide-covered copper in aqueous electrolytes modified by self-assembled monolayers. ElecNano8, the 8th international conference on Electrochemistry in Nanosciences
, Nancy, France (2018)
Rechmann, J.: Oberflächenmodifizierung von Zink (Eisen) mit Ethinylphenothiazinen und Charakterisierung. Master, Institut für Organische und Makromolekulare Chemie, Heinrich-Heine-Universität Düsseldorf, Düsseldorf, Germany (2014)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…