Mondragón Ochooa, J. S.; Altin, A.; Rechmann, J.; Erbe, A.: Delamination Kinetics of Thin Film Poly(acrylate) Model Coatings Prepared by Surface Initiated Atom Transfer Radical Polymerization on Iron. Journal of the Electrochemical Society 165 (16), pp. C991 - C998 (2018)
Mondragon Ochoa, J. S.; Altin, A.; Erbe, A.: Comparison of cathodic delamination of poly(n-alkyl methacrylates) on iron. Materials and Corrosion - Werkstoffe und Korrosion 68, pp. 1326 - 1332 (2017)
Mondragon Ochoa, J. S.; Altin, A.; Rohwerder, M.; Erbe, A.: Surface Modification of Iron With Grafted Hydrophobic Acrylic Polymers and Study of Their Delamination Kinetics. Polymers and Organic Chemistry POC16, Hersonissos (Crete), Greece (2016)
Mondragon Ochoa, J. S.: Preparation of Polyacrylic Thin Films on Iron by Controlled Radical Polymerization and their Delamination Behaviour. Dissertation, Ruhr-Universität Bochum, Bochum, Germany (2018)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.
This project aims to investigate the dynamic hardness of B2-iron aluminides at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1 and study the microstructure evolution across strain rate range.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.