Yan, D.; Tasan, C. C.; Raabe, D.: High resolution strain mapping coupled with EBSD during in-situ tension in SEM. BSSM 9th Int. Conf. on Advances in Experimental Mechanics, Cardiff, UK (2013)
Gutiérrez-Urrutia, I.; Raabe, D.: Electron channelling contrast imaging under controlled diffraction conditions: A powerful technique to characterize deformation structures in the SEM. Euromat 2013, Sevilla, Spain (2013)
Herbig, M.; Choi, P.; Raabe, D.: Combining Structural and Chemical Information on the nm Scale by Correlative TEM and APT Characterization. Euromat 2013, Sevilla, Spain (2013)
Kuzmina, M.; Ponge, D.; Raabe, D.: Embrittlement effect in medium Fe–Mn alloys. Study of grain boundary segregation. Euromat 2013, Sevilla, Spain (2013)
Yan, D.; Tasan, C. C.; Raabe, D.: High resolution strain mapping coupled with EBSD during in-situ tension in SEM. Interdisciplinary Center for Advanced materials Simulation (ICAMS), Ruhr-Universität Bochum, Bochum, Germany (2013)
Zhang, H.; Ponge, D.; Raabe, D.: The superplasticity evaluation of a Mn–Si–Cr alloyed steel at different microstructural and deformation conditions. Euromat 2013, Sevilla, Spain (2013)
Zhang, J.; Tasan, C. C.; Lai, M.; Springer, H.; Raabe, D.: Microstructural and Mechanical Characterization of Cold Work Effects in GUM Metal. 9th International Conference on Advances in Experimental Mechanics, Cardiff, UK (2013)
Gutiérrez-Urrutia, I.; Raabe, D.: High performance lightweight steels. 8th Pacific Rim International Congress on Advanced Materials and Processing (PRICM-8), Waikoloa, Hawai, USA (2013)
Gutiérrez-Urrutia, I.; Seol, J.-B.; Marceau, R. K. W.; Choi, P.; Raabe, D.: Multi-scale characterization of advanced structural steels: from the micro to the atomic-scale. 8th Pacific Rim International Congress on Advanced Materials and Processing (PRICM-8), Waikoloa, Hawai, USA (2013)
Herbig, M.; Choi, P.; Raabe, D.: Combining Structural and Chemical Information on the nm Scale by Correlative TEM and APT Characterization. Microscopy and Microanalysis 2013, Indianapolis, IN, USA (2013)
Li, Y. J.; Choi, P.; Herbig, M.; Kostka, A.; Goto, S.; Borchers, C.; Raabe, D.; Kirchheim, R.: Atomic Scale Understanding of 6.8 GPa Ultra-high Strength Pearlite. 8th Pacific Rim International Congress on Advanced Materials and Processing (PRICM-8), Waikoloa, HI, USA (2013)
Diehl, M.; Yan, D.; Tasan, C. C.; Shanthraj, P.; Eisenlohr, P.; Roters, F.; Raabe, D.: Stress-strain partitioning in martensitic-ferritic steels analyzed by integrated full-field crystal plasticity simulations and high resolution in situ experiments. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
Yan, D.; Tasan, C. C.; Raabe, D.: Coupled high resolution strain and microstructure mapping based on digital image correlation and electron backscatter diffraction. IMPRS-SurMat Seminar, Meschede, Germany (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…