Brink, T.; Langenohl, L.; Ahmad, S.; Liebscher, C.; Dehm, G.: Atomistic Modeling of the Thermodynamics of Grain Boundaries in fcc Metals. 19th International Conference on Diffusion in Solids and Liquids, Crete, Greece (2023)
Dehm, G.: Grain boundary phases in metallic materials: Structure, stability and properties. MiFuN III - Microstructural Functionality at the Nanoscale, Venice, Italy (2023)
Dehm, G.: On the interplay between grain boundary complexions and chemical composition for fcc metals. Possibilities and Limitations of Quantitative Materials Modeling and Characterization 2023, Bernkastel-Kues, Germany (2023)
Brink, T.; Bhat, M. K.; Best, J. P.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. DPG Spring Meeting, Dresden, Germany (2023)
Kanjilal, A.; Rehman, U.; Best, J. P.; Dehm, G.: Microscale fracture behavior of Laves phases in the Mg–Ca–Al ternary alloy system. 86. Annual Meeting of DPG and DPG-Frühjahrstagung (DPG Spring Meeting) of the Matter and Cosmos Section (SMuK), Dresden, Germany (2023)
Kanjilal, A.; Rehman, U.; Best, J. P.; Dehm, G.: Microscale fracture behavior of Laves phases in the Mg–Ca–Al ternary alloy system. DPG-Frühjahrstagung (DPG Spring Meeting) of the Condensed Matter Section (SKM), Dresden, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)
Brognara, A.; Best, J. P.; Djemia, P.; Faurie, D.; Dehm, G.; Ghidelli, M.: Effect of composition and nanolayering on mechanical properties of Zr100-xCux thin film metallic glasses. Talk at Université catholique de Louvain (UCL), Louvain-la-Neuve, Belgium (2022)
Hosseinabadi, R.; Riesch-Oppermann, H.; Best, J. P.; Dehm, G.; Kirchlechner, C.: Size-dependent coherent twin boundary strength contribution in Cu micropillars. Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
Hosseinabadi, R.; Riesch-Oppermann, H.; Best, J. P.; Dehm, G.; Kirchlechner, C.: Size effect in bi-crystalline Cu micropillars with a coherent twin boundary. ECI conference 2022, Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.
This project aims to develop a testing methodology for the nano-scale samples inside an SEM using a high-speed nanomechanical low-load sensor (nano-Newton load resolution) and high-speed dark-field differential phase contrast imaging-based scanning transmission electron microscopy (STEM) sensor.
The thorough, mechanism-based, quantitative understanding of dislocation-grain boundary interactions is a central aim of the Nano- and Micromechanics group of the MPIE [1-8]. For this purpose, we isolate a single defined grain boundary in micron-sized sample. Subsequently, we measure and compare the uniaxial compression properties with respect to…