Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Effect of the atomic structure of complexions on the active disconnection mode during shear-coupled grain boundary motion. Physical Review Materials 8 (6), 063602 (2024)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)
Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)
Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research
Society
, Virtual (2021)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.