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Micro-fracture toughness of AuXSnY intermetallic compounds

The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.

Au-Sn based soldering materials are among the most promising replacement materials of lead-containing materials applied at high temperature range. Their fracture toughness is of great importance for the reliability of electronic chips during service.

The project aims at obtaining the micro-fracture toughness of AuXSnY intermetallic compounds as they tend to fracture more than other constituents of the chips. Free-standing cantilevers with notches are fabricated by focused ion beam (Fig. 1) and tested in-situ with an indenter inside a scanning electron microscope. The results of the experiments will offer a guideline for the industry to design better Au-Sn based soldering materials.

Fig. 1, Schematic illustration of the micro-fracture toughness measurement method

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