Kirchlechner, C.; Malyar, N.; Dehm, G.: Insights into dislocation grain-boundary interaction by X-ray µLaue diffraction. Dislocations 2016, West Lafayette, IN, USA (2016)
Dehm, G.: Deformation and Adhesion of Metallic Thin Films. International Conference on Metallurgical Coatings and Thin Films, 43rd ICMCTF, San Diego, CA, USA (2016)
Kirchlechner, C.; Malyar, N.; Imrich, P. J.; Dehm, G.: Dislocation twin boundary interaction and its dependence on loading direction. 62. Metallkunde-Kolloquium, Lech am Arlberg, Austria (2016)
Harzer, T. P.; Duarte, M. J.; Dehm, G.: In-situ TEM isothermal annealing of nanocrystalline supersaturated Cu–Cr thin film alloys. 80th Annual Conference of the DPG and DPG Spring Meeting, Regensburg, Germany (2016)
Jaya, B. N.; Köhler, M.; Schnabel, V.; Raabe, D.; Schneider, J. M.; Kirchlechner, C.; Dehm, G.: Micro-scale fracture behavior of Co based metallic glass thin films. 2016 TMS Annual Meeting and Exhibition Symposium: In Operando Nano- and Micro-mechanical Characterization of Materials with Special Emphasis on In Situ Techniques, Nashville, TN, USA (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Investigation of solid state dewetting phenomena of epitaxial Al thin films on sapphire using electron microscopy. The 16th European Microscopy Congress (EMC 2016), Lyon, France (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Solid state dewetting of epitaxial Al thin films on sapphire studied by electron microscopy. Materials Research Society Fall Meeting & Exhibition 2016 (MRS Fall 2016), Boston, MA, USA (2016)
Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: A New Method to Study the Composition Dependence of Mechanical Properties of Laves. MRS Fall Meeting 2016, Boston, MA, USA (2016)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.