Devulapalli, V.; Bishara, H.; Ghidelli, M.; Dehm, G.; Liebscher, C.: Influence of substrates and e-beam evaporation parameters on the microstructure of nanocrystalline and epitaxially grown Ti thin films. Applied Surface Science 562, 150194 (2021)
Bishara, H.; Ghidelli, M.; Dehm, G.: Approaches to Measure the Resistivity of Grain Boundaries in Metals with High Sensitivity and Spatial Resolution: A Case Study Employing Cu. ACS Applied Electronic Materials 2 (7), pp. 2049 - 2056 (2020)
Bueno Villoro, R.; Luo, T.; Bishara, H.; Abdellaoui, L.; Gault, B.; Wood, M.; Snyder, G. J.; Scheu, C.; Zhang, S.: Effect of grain boundaries on electrical conductivity in Ti(Co,Fe)Sb half Heusler thermoelectrics. 719. WE-Heraeus-Seminar, Understanding Transport Processes on the Nanoscale for Energy Harvesting Devices, online (2021)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Electro-responsive interfaces alter their properties in response to an electric potential trigger. Hence, such 'smart' interfaces offer exciting possibilities for applications in, for instance, microfluidics, separation systems, biosensors and -analytics.
This project studies the mechanical properties and microstructural evolution of a transformation-induced plasticity (TRIP)-assisted interstitial high-entropy alloy (iHEA) with a nominal composition of Fe49.5Mn30Co10Cr10C0.5 (at. %) at cryogenic temperature (77 K). We aim to understand the hardening behavior of the iHEA at 77 K, and hence guide the future design of advanced HEA for cryogenic applications.