Lymperakis, L.; Neugebauer, J.: Ab-initio based multiscale calculations of low-angle grain boundaries in Aluminium. Materials Research Society fall meeting, Boston, MA, USA (2005)
Neugebauer, J.: Application and Implementation of Electronic Structure Methods. Lecture: Ruhr-Universität Bochum, SS 2015, Bochum, Germany, April 01, 2015 - September 30, 2015
Neugebauer, J.: Application and Implementation of Electronic Structure Methods. Lecture: Ruhr-Universität Bochum, SS 2014, Bochum, Germany, April 01, 2014 - September 30, 2014
Neugebauer, J.: Application and Implementation of Electronic Structure Methods. Lecture: Ruhr-Universität Bochum, SS 2013 , Bochum, Germany, April 01, 2013 - September 30, 2013
Neugebauer, J.; Hickel, T.: Moderne Computersimulations-Methoden in der Festkörperphysik. Lecture: Hands-on-Tutorial, Ruhr-Universität Bochum, Bochum, Germany, September 20, 2010 - September 24, 2010
Neugebauer, J.; Hickel, T.: Computerpraktikum: Moderne Computersimulationsmethoden in der Festkörperphysik. Lecture: Blockpraktikum, MPIE, Düsseldorf, Germany, September 20, 2010 - September 24, 2010
Lochner, F.: Interplay of Real Space and Electronic Structure for Iron-Based Superconductors: An ab initio Study. Dissertation, Ruhr-Universität Bochum, Germany (2021)
Surendralal, S.: Development of an ab initio computational potentiostat and its application to the study of Mg corrosion. Dissertation, Ruhr Universität Bochum (2020)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Hydrogen in aluminium can cause embrittlement and critical failure. However, the behaviour of hydrogen in aluminium was not yet understood. Scientists at the Max-Planck-Institut für Eisenforschung were able to locate hydrogen inside aluminium’s microstructure and designed strategies to trap the hydrogen atoms inside the microstructure. This can…
This ERC-funded project aims at developing an experimentally validated multiscale modelling framework for the prediction of fracture toughness of metals.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…