Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Effect of the atomic structure of complexions on the active disconnection mode during shear-coupled grain boundary motion. Physical Review Materials 8 (6), 063602 (2024)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Deformation mechanism of complexions in a Cu grain boundary under shear. FEMS EUROMAT 2023, Frankfurt am Main, Germany (2023)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Disconnection activation in complexions of a Cu grain boundary under shear. 19th International Conference on Diffusion in Solids and Liquids (DSL-2023), Heraklion, Greece (2023)
Pemma, S.; Brink, T.; Janisch, R.; Dehm, G.: Stress driven grain boundary migration for different complexions of a Cu tilt grain boundary. Materials Science and Engineering Congress 2022, Darmstadt, Germany (2022)
Pemma, S.; Janisch, R.; Dehm, G.; Brink, T.: Atomistic simulation study of grain boundary migration for different complexions in copper. DPG-Tagung, Virtual (2021)
Brink, T.; Frommeyer, L.; Freitas, R.; Frolov, T.; Pemma, S.; Liebscher, C.; Dehm, G.: Diffusionless congruent grain boundary phase transitions in metals: Simulation and experimental imaging. 2021 Fall Meeting of the European Materials Research
Society
, Virtual (2021)
Max Planck scientists design a process that merges metal extraction, alloying and processing into one single, eco-friendly step. Their results are now published in the journal Nature.
Scientists of the Max-Planck-Institut für Eisenforschung pioneer new machine learning model for corrosion-resistant alloy design. Their results are now published in the journal Science Advances
Hydrogen in aluminium can cause embrittlement and critical failure. However, the behaviour of hydrogen in aluminium was not yet understood. Scientists at the Max-Planck-Institut für Eisenforschung were able to locate hydrogen inside aluminium’s microstructure and designed strategies to trap the hydrogen atoms inside the microstructure. This can…
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
In 2020, an interdepartmental software task force (STF) was formed to serve as a forum for discussion on topics related to software development and digital workflows at the MPIE. A central goal was to facilitate interdepartmental collaboration by co-developing and integrating workflows, aligning internally developed software, and rolling out…