Kirchlechner, C.; Malyar, N.; Imrich, P. J.; Dehm, G.: Dislocation twin boundary interaction and its dependence on loading direction. 62. Metallkunde-Kolloquium, Lech am Arlberg, Austria (2016)
Harzer, T. P.; Duarte, M. J.; Dehm, G.: In-situ TEM isothermal annealing of nanocrystalline supersaturated Cu–Cr thin film alloys. 80th Annual Conference of the DPG and DPG Spring Meeting, Regensburg, Germany (2016)
Jaya, B. N.; Köhler, M.; Schnabel, V.; Raabe, D.; Schneider, J. M.; Kirchlechner, C.; Dehm, G.: Micro-scale fracture behavior of Co based metallic glass thin films. 2016 TMS Annual Meeting and Exhibition Symposium: In Operando Nano- and Micro-mechanical Characterization of Materials with Special Emphasis on In Situ Techniques, Nashville, TN, USA (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Investigation of solid state dewetting phenomena of epitaxial Al thin films on sapphire using electron microscopy. The 16th European Microscopy Congress (EMC 2016), Lyon, France (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Solid state dewetting of epitaxial Al thin films on sapphire studied by electron microscopy. Materials Research Society Fall Meeting & Exhibition 2016 (MRS Fall 2016), Boston, MA, USA (2016)
Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: A New Method to Study the Composition Dependence of Mechanical Properties of Laves. MRS Fall Meeting 2016, Boston, MA, USA (2016)
Dehm, G.: Mikromechanik: lokale Einblicke in die mechanischen Eigenschaften von Materialien. Eröffnung des Christian Doppler Labors für
Lebensdauer und Zuverlässigkeit von Grenzflächen in komplexen Mehrlagenstrukturen der Elektronik „RELAB“, Vienna, Austria (2015)
Dehm, G.: New insights into the mechanical behavior of interface controlled metals. Colloquium Materials Modelling, Institut für Materialprüfung, Werkstoffkunde und Festigkeitslehre (IMWF), Universität Stuttgart , Stuttgart, Germany (2015)
Dehm, G.; Imrich, P. J.; Malyar, N.; Kirchlechner, C.: Differences in deformation behavior of bicrystalline Cu micropillars containing different grain boundaries. MS&T 2015 (Materials Science and Technology) meeting, symposium entitled "Deformation and Transitions at Grain Boundaries", Columbus, OH, USA (2015)
Dehm, G.; Zhang, Z.; Völker, B.: Structure and strength of metal-ceramic interfaces: New insights by Cs corrected TEM and advances in miniaturized mechanical testing. MS&T 2015 (Materials Science and Technology) meeting, Symposium entitled "Structures and Properties of Grain Boundaries: Towards an atomic-scale understanding of ceramics", Columbus, OH, USA (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The segregation of impurity elements to grain boundaries largely affects interfacial properties and is a key parameter in understanding grain boundary (GB) embrittlement. Furthermore, segregation mechanisms strongly depend on the underlying atomic structure of GBs and the type of alloying element. Here, we utilize aberration-corrected scanning…
The nano-structure of surfaces influences the interactions and reactions occurring on it, which has strong impacts for applications in diverse fields, such as wetting phenomena, electrochemistry or biotechnology. We study these nanoscale structures on functional interfaces by nano-spectroscopy. Furthermore we try to understand their influence on…
Nickel-based alloys are a particularly interesting class of materials due to their specific properties such as high-temperature strength, low-temperature ductility and toughness, oxidation resistance, hot-corrosion resistance, and weldability, becoming potential candidates for high-performance components that require corrosion resistance and good…
In this project, we aim at significantly enhancing the strength-ductility combination of quinary high-entropy alloys (HEAs) with five principal elements by simultaneously introducing interstitial C/N and the transformation induced plasticity (TRIP) effect. Thus, a new class of alloys, namely, interstitially alloyed TRIP-assisted quinary (five-component) HEAs is being developed.