Jentner, R.; Tsai, S.-P.; Welle, A.; Scholl, S.; Srivastava, K.; Best, J. P.; Kirchlechner, C.; Dehm, G.: Automated classification of granular bainite and polygonal ferrite by electron backscatter diffraction verified through local structural and mechanical analyses. Journal of Materials Research 38 (18), pp. 4177 - 4191 (2023)
Tsai, S.-P.; Konijnenberg, P. J.; Gonzalez, I.; Hartke, S.; Griffiths, T. A.; Herbig, M.; Kawano-Miyata, K.; Taniyama, A.; Sano, N.; Zaefferer, S.: Development of a new, fully automated system for electron backscatter diffraction (EBSD)-based large volume three-dimensional microstructure mapping using serial sectioning by mechanical polishing, and its application to the analysis of special boundaries in 316L stainless steel. Review of Scientific Instruments 93, 093707 (2022)
Nandy, S.; Tsai, S.-P.; Stephenson, L.; Raabe, D.; Zaefferer, S.: The role of Ca, Al and Zn on room temperature ductility and grain boundary cohesion of magnesium. Journal of Magnesium and Alloys 9 (5), pp. 1521 - 1536 (2021)
Tsai, S.-P.; Zaefferer, S.: Large-volume 3D EBSD system and its application to the investigation of grain boundary corrosion in 316L stainless steel. 3D MS conference, online (2021)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.