Publications of Bo Yang

Yang, B.; Motz, C.; Rester, M.; Dehm, G.: Yield stress influenced by the ratio of wire diameter to grain size – a competition between the effects of specimen microstructure and dimension in micro-sized polycrystalline copper wires. Philosophical Magazine Letters; Nano-mechanical testing in materials research and development III 92 (25-27), pp. 3243 - 3256 (2012)

Yang, B.; Motz, C.; Grosinger, W.; Dehm, G.: Stress-controlled fatigue behaviour of micro-sized polycrystalline copper wires. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 515 (1-2), pp. 71 - 78 (2009)

Yang, B.; Motz, C.; Grosinger, W.; Kammrath, W.; Dehm, G.: Tensile behaviour of micro-sized copper wires studied by a novel fibre tensile module. International Journal of Materials Research 99 (7), pp. 716 - 724 (2008)

Kiener, D.; Rester, M.; Scheriau, S.; Yang, B.; Pippan, R.; Dehm, G.: Influence of external and internal length scale on the flow stress of copper. International Journal of Materials Research 98 (11), pp. 1047 - 1053 (2007)

Yang, B.; Motz, C.; Grosinger, W.; Dehm, G.: Cyclic loading behavior of micro-sized polycrystalline copper wires. 10th International Fatigue Congress, FATIGUE 2010, Prague, Czech Republic, June 06, 2010 - June 11, 2010. Procedia Engineering 2 (1), pp. 925 - 930 (2010)

Dehm, G.; Kirchlechner, C.; Imrich, P. J.; Smolka, M.; Wimmer, A. C.; Yang, B.; Zhang, Z.: Plasticity and Fracture at Small Length Scales: From Single Crystals Towards Interfaces. Workshop on Mechanical Behaviour of Systems - 4, Coorg, Karnataka, India (2013)

Dehm, G.; Imrich, P. J.; Kirchlechner, C.; Smolka, M.; Yang, B.; Motz, C.: In situ micro- and nanomechanical electron microscopy studies of grain boundaries in Cu. MRS Fall Meeting 2012, Boston, MA, USA (2012)