Segregation effects of interstitial and substitutional elements at grain boundaries in ferritic iron and their effect on liquid metal embrittlement

Publications of Sutatch Ratanaphan

Journal Article (1)

1.
Journal Article
Ratanaphan, S.; Raabe, D.; Sarochawikasit, R.; Olmsted, D. L.; Rohrer, G. S.; Tu, K.: Grain boundary character distribution in electroplated nanotwinned copper. Journal of Materials Science 52 (7), pp. 4070 - 4085 (2017)
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Talk (1)

2.
Talk
Ratanaphan, S.; Xu, D.; Xu, L.; Raabe, D.; Tu, K.: Grain Boundary Engineering in Copper Through-via Silicon Interconnects. MRS Fall Conference 2008, Boston, MA, USA (2008)
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