Hassel, A. W.; Diesing, D.: Breakdown of ultrathin anodic valve metal oxide films in metal-insulator-metal-contacts compared with metal-insulator-electrolyte contacts. Thin Solid Films 414, pp. 296 - 303 (2002)
Hassel, A. W.; Diesing, D.: Trapping of transient processes in aluminium oxide thin films in a voltage pulse experiment. Electrochemistry Communications 4, pp. 1 - 4 (2002)
Hassel, A. W.; van der Kloet, J.; Schmidt, W.; Stratmann, M.: In-situ SKP Investigation and ToF-SIMS Analysis of Filiform Corrosion on Aluminium Alloy 2024-T3. Proceed. Japan Soc. CoRR. Engineer. Mater. Environments 48, pp. 61 - 69 (2001)
Mozalev, A.; Poznyak, A.; Mozaleva, I.; Hassel, A. W.: The voltage-time behaviour for porous anodizing of aluminium in a fluoride-containing oxalic acid electrolyte. Electrochem. Commun. 3, pp. 299 - 305 (2001)
Seo, M.; Aihara, M.; Hassel, A. W.: Cathodic Decomposition and Anodic Dissolution and Changes in Surface Morphology of n-type InP in HCl. J. Electrochem. Soc. 148, pp. B400 - B404 (2001)
Seo, M.; Aihara, M.; Hassel, A. W.: Cathodic Decomposition and Changes in Surface Morphology of InP in HCl. Electrochem. Soc. Proc. PV 00-25, pp. 576 - 585 (2000)
Diesing, D.; Hassel, A. W.; Lohrengel, M. M.: Aluminium Oxide Tunnel Junctions: Influence of Preparation Technique, Sample Geometry and Oxide Thickness. Thin Solid Films 342, pp. 282 - 290 (1999)
Hassel, A. W.; Seo, M.: Localised Investigation of Coarse Grain Gold with the Scanning Droplet Cell and by the Laue Method. Electrochim. Acta 44, pp. 3769 - 3777 (1999)
Hassel, A. W.; Lohrengel, M. M.: The Scanning Droplet Cell and its Application to Structured Nanometer Oxide Films on Aluminium. Electrochimica Acta 42, pp. 3327 - 3333 (1997)
Hassel, A. W.; Lohrengel, M. M.; Schultze, J. W.: Ultradünne Aluminiumoxidschichten: Untersuchung elektronischer und ionischer Transportprozesse. Metalloberfläche 50, pp. 19 - 22 (1996)
Hassel, A. W.; Lohrengel, M. M.; Schultze, J. W.: Ultradünne Aluminiumoxidschichten: Untersuchung elektronischer und ionischer Transportprozesse. Metalloberfläche 50, pp. 19 - 22 (1996)
Hassel, A. W.; Lohrengel, M. M.: Preparation and Properties of Ultra Thin Anodic Valve Metal Oxide Films. Materials Science Forum 185-188, pp. 581 - 590 (1995)
Hassel, A. W.; Lohrengel, M. M.; Rüße, S.; Schultze, J. W.: On the Mechanism of Ion Transport in Thin (1-100 nm) Oxide Films on Aluminum and Tantalum. Bulletin of the Chemists and Technologists of Macedonia 13, pp. 49 - 54 (1994)
Hassel, A. W.; Bonk, S.; Wicinski, M.; Stratmann, M.; Ogle, K.; Philips-Falcey, N.; Ostwald, C.; Janssen, S.; Stellnberger, K.-H.; Konrath, P.: Passive/active transistions in cyclic corrosion tests. Office for Official Publications of the European Communities, Luxembourg, Luxembourg (2007)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…