Saood, S.; Brink, T.; Liebscher, C.; Dehm, G.: Atomic structure of [111] tilt boundaries of Al in relation to their crystallographic parameters. International Microscopy Conference 2023 (IMC-20), Busan, South Korea (2023)
Brink, T.; Milanese, E.; Frérot, L.; Molinari, J.-F.: Simulation of adhesive wear mechanisms at the nanoscale and an approach towards mesoscale models. MSE Congress, Darmstadt, Germany (2022)
Frommeyer, L.; Brink, T.; Dehm, G.; Liebscher, C.: Atomic scale observations of Ag segregation in a high angle grain boundary in Cu. PICO 2022, Kasteel Vaalsbroek, The Netherlands (2022)
Frommeyer, L.; Brink, T.; Freitas, R.; Frolov, T.; Dehm, G.; Liebscher, C.: Characterization of the atomic structure of grain boundary phases in pure Cu. Sixth Conference on Frontiers of Aberration Corrected Electron Microscopy PICO 2021, vitual, Kasteel Vaalsbroek, The Netherlands (2021)
Brink, T.: Thermodynamics. Lecture: Lecture on Thermodynamics, Max Planck Institut für Eisenforschung (demnächst Max Planck Institute for Sustainable Materials), 4 lectures à 2 h, Düsseldorf, Germany, May 14, 2024 - June 11, 2024
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.