Posner, R.; Fink, N.; Giza, G.; Grundmeier, G.: Corrosive delamination and ion transport along stretch-formed thin conversion films on galvanized steel. Surface and Coatings Technology 253, pp. 227 - 233 (2014)
Posner, R.; Fink, N.; Wolpers, M.; Grundmeier, G.: Electrochemical electrolyte spreading studies of the protective properties of ultra-thin films on zinc galvanized steel. Surface and Coatings Technology 228, pp. 286 - 295 (2013)
Özcan, Ö.; Pohl, K.; Keil, P.; Grundmeier, G.: Effect of hydrogen and oxygen plasma treatments on the electrical and electrochemical properties of zinc oxide nanorod films on zinc substrates. Electrochemistry Communications 13 (8), pp. 837 - 839 (2011)
Giza, M.; Grundmeier, G.: Combination of FTIR Reflection Absorption Spectroscopy and Work Function Measurements for In Situ Studies of Plasma Modified Passive Films on MgZn2. Plasma Processes and Polymers 8 (7), pp. 607 - 616 (2011)
Itani, H.; Santa, M.; Keil, P.; Grundmeier, G.: Backside SERS Studies of Inhibitor Transport Through Polyelectrolyte Films on Ag-substrates. Journal of Colloid and Interface Science 357 (2), pp. 480 - 486 (2011)
Posner, R.; Sundell, P. E.; Bergman, T.; Roose, P.; Heylen, M.; Grundmeier, G.; Keil, P.: UV-Curable Polyester Acrylate Coatings: Barrier Properties and Ion Transport Kinetics Along Polymer/Metal Interfaces. Journal of the Electrochemical Society 158 (6), pp. C185 - C193 (2011)
Posner, R.; Santa, M.; Grundmeier, G.: Wet- and Corrosive De-Adhesion Processes of Water-Borne Epoxy Film Coated Steel I. Interface Potentials and Characteristics of Ion Transport Processes. Journal of the Electrochemical Society 158 (3), pp. C29 - C35 (2011)
Santa, M.; Posner, R.; Grundmeier, G.: Wet- and Corrosive De-Adhesion Processes of Water-Borne Epoxy Film Coated Steel II. The Influence of -Glycidoxypropyltrimethoxysilane as an Adhesion Promoting Additive. Journal of the Electrochemical Society 158 (3), pp. C36 - C41 (2011)
Grundmeier, G.; Posner, R.: Disbonding processes at polymer-metal interfaces: From a molecular-level understanding to self-healing processes. Galvanotechnik 101 (6), pp. 1253 - 1255 (2010)
Posner, R.; Giza, G.; Marazita, M.; Grundmeier, G.: Ion transport processes at polymer/oxide/metal interfaces under varying corrosive conditions. Corrosion Science 52 (5), pp. 1838 - 1846 (2010)
Posner, R.; Marazita, M.; Amthor, S.; Roschmann, K. J.; Grundmeier, G.: Influence of interface chemistry and network density on interfacial ion transport kinetics for styrene/acrylate copolymer coated zinc and iron substrates. Corrosion Science 52 (3), pp. 754 - 760 (2010)
Titz, T.; Hoerzenberger, F.; Van den Bergh, K.; Grundmeier, G.: Correlation of interfacial electrode potential and corrosion resistance of plasma polymer coated galvansied steel. Part 2: Influence of forming induced defects. Corrosion Science 52 (2), pp. 378 - 386 (2010)
Thissen, P.; Valtiner, M.; Grundmeier, G.: Stability of Phosphonic Acid Self-Assembled Monolayers on Amorphous and Single-Crystalline Aluminum Oxide Surfaces in Aqueous Solution. Langmuir 26 (1), pp. 156 - 164 (2010)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…