Winning, M.; Brahme, A.; Raabe, D.: Prediction of cold rolling textures of steels using an artificial neural network. Computational Materials Science 46, pp. 800 - 804 (2009)
Winning, M.; Raabe, D.; Brahme, A.: A texture component model for predicting recrystallization textures. Materials Science Forum 558 / 559, pp. 1035 - 1042 (2007)
Brahme, A.; Winning, M.; Raabe, D.: Texture Component Model for Predicting Recrystallization Textures. 15th International Conference on the Texture of Materials (ICOTOM 15), Pittsburgh, PA, USA (2008)
Brahme, A.: Brief Introduction to Cellular Automaton and Monte Carlo Method. MPIE inter-departmental tutorial day(s) 2008, MPI für Eisenforschung GmbH, Düsseldorf, Germany (2008)
Winning, M.; Raabe, D.; Brahme, A.: A texture component model for predicting recrystallization textures. The Third International Conference on Recrystallization and Grain Growth, Jeju Island, South Korea (2007)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…