Inkson, B. J.; Dehm, G.; Peng, Y.: Dynamical growth of Cu-Pt nanowires with a nanonecklace morphology. Nanotechnology 18 (41), 415601, pp. 1 - 5 (2007)
Oh, S. H.; Legros, M.; Kiener, D.; Gruber, P. A.; Dehm, G.: In situ TEM straining of single crystal Au films on polyimide: Change of deformation mechanisms at the nanoscale. Acta Materialia 55 (16), pp. 5558 - 5571 (2007)
Kiener, D.; Motz, C.; Rester, M.; Jenko, M.; Dehm, G.: FIB damage of Cu and possible consequences for miniaturized mechanical tests. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 459 (1-2), pp. 262 - 272 (2007)
Kiener, D.; Motz, C.; Schöberl, T.; Jenko, M.; Dehm, G.: Determination of mechanical properties of copper at the micron scale. Advanced Engineering Materials 8 (11), pp. 1119 - 1125 (2006)
Riethmüller, J.; Dehm, G.; Affeldt, E. E.; Arzt, E.: Microstructure and mechanical behavior of Pt-modified NiAl diffusion coatings. International Journal of Materials Research 97 (6), pp. 689 - 698 (2006)
Wetscher, F.; Pippan, R.; Šturm, S.; Kauffmann, F.; Scheu, C.; Dehm, G.: TEM investigation of the structural evolution in a pearlitic steel deformed by high pressure torsion. Metallurgical and Materials Transactions a-Physical Metallurgy and Materials Science 37 (6), pp. 1963 - 1968 (2006)
Kauffmann, F.; Ji, B.; Dehm, G.; Gao, H.; Arzt, E.: A quantitative study of the hardness in a superhard nanocrystalline titanium nitride/silicon nitride coating. Scripta Materialia 52 (12), pp. 1269 - 1274 (2005)
Dehm, G.; Edongué, H.; Wagner, T. A.; Oh, S. H.; Arzt, E.: Obtaining different orientation relationships for Cu films grown on (0001) α-Al2O3 substrates by magnetron sputtering. Zeitschrift für Metallkunde 96 (3), pp. 249 - 254 (2005)
Sauter, L. X.; Balk, T. J.; Dehm, G.; Nucci, J.; Arzt, E.: Hillock Formation and Thermal Stresses in Thin Au Films on Si Substrates. Materials Research Society Symposium Proceedings 875, O5.2, pp. 177 - 182 (2005)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…