Bonk, S.; Wicinski, M.; Hassel, A. W.; Stratmann, M.: Electrochemical characterizations of precipitates formed on zinc in alkaline sulphate solution with increasing pH values. Electrochemistry Communicatios 6, 8, pp. 800 - 804 (2004)
Hassel, A. W.; Bonk, S.; Wicinski, M.; Stratmann, M.; Ogle, K.; Philips-Falcey, N.; Ostwald, C.; Janssen, S.; Stellnberger, K.-H.; Konrath, P.: Passive/active transistions in cyclic corrosion tests. Office for Official Publications of the European Communities, Luxembourg, Luxembourg (2007)
Hassel, A. W.; Bonk, S.; Wicinski, M.; Stratmann, M.: Corrosion of zinc coated steel sheets under cyclic corrosion conditions. 13th Asian Pacific Corrosion Control Conference, Osaka, Japan (2003)
Bonk, S.; Tsuri, S.; Hassel, A. W.; Stratmann, M.: Construction of a cyclic corrosion test simulator. GDCH Jahrestagung 2003, Fachgruppe Angewandte Elektrochemie mit 8. Grundlagensymposium der GDCh, DECHEMA, DBG, München, Germany (2003)
Bonk, S.; Wicinski, M.; Hassel, A. W.; Stratmann, M.: Sensitivity of pure zinc and zinc-alloyed steel sheets to pH-changes in alkaline electrolyte. Electrochem 2003, Southhampton, UK (2003)
Bonk, S.; Wicinski, M.; Hassel, A. W.; Stratmann, M.: Elektrochemische Untersuchungen verzinkter Stähle in alkalischer Sulfatlösung bei verschiedenen pH-Werten. 79. AGEF Seminar - 25 Jahre Elektrochemie in Düsseldorf, Düsseldorf, Germany (2004)
Bonk, S.; Tsuri, S.; Hassel, A. W.; Stratmann, M.: Entwicklung eines universellen Wechseltauchsimulators für die Durchführung beschleunigter, zyklischer Korrosionstests. 76. AGEF Seminar, Düsseldorf, Germany (2003)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…