Diehl, M.; Roters, F.; Raabe, D.: Coupled Experimental-Computational Investigations of Grain Scale Mechanics in Complex Metallic Microstructures. 15th U.S. National Congress on Computational Mechanics, Ausrin, TX, USA (2019)
Han, F.; Diehl, M.; Roters, F.; Raabe, D.: Multi-scale modeling of plasticity. ICIAM 2019 - The 9th International Congress on Industrial and Applied Mathematics, Valencia, Spain (2019)
Liu, C.; Shanthraj, P.; Roters, F.; Raabe, D.: Phase-field/CALPHAD methods for multi-phase and multi-component microstructures. The 4th International Symposium on Phase Field Modelling in Materials Science (PF 19), Bochum, Germany (2019)
Raabe, D.: Metastable Nanostructured Metallic Alloy. The KAIST Lecture in Materials Science and Engineering 2019, Korea Advanced Institute of Science and Technology KAIST, Daejeon, Korea (2019)
Raabe, D.: Atomic-Scale Analysis of Chemistry at Lattice Defects. The KAIST Lecture in Materials Science and Engineering 2019, Korea Advanced Institute of Science and Technology KAIST, Daejeon, Korea (2019)
Su, J.; Raabe, D.; Li, Z.: On the mechanism of displacive phase transformation in metastable high entropy alloys. DPG Regensburg 2019, Regensburg, Germany (2019)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.