Trinca, A.; Verdone, N.; Özgün, Ö.; Ma, Y.; Filho, I.; Raabe, D.; Vilardi, G.: Sustainable ironmaking from low-grade iron ores: A kinetic study on thermal decomposition and reduction of iron (II) oxalate. Journal of Environmental Chemical Engineering 13 (6), 119573 (2025)
Dong, X.; Wei, S.; Tehranchi, A.; Saksena, A.; Ponge, D.; Sun, B.; Raabe, D.: The dual role of boron on hydrogen embrittlement: example of interface-related hydrogen effects in an austenite-ferrite two-phase lightweight steel. Acta Materialia 299, 121458 (2025)
Büyükuslu, Ö.; Yang, F.; Raabe, D.; To Baben, M.; Ravensburg, A.: Using Thermodynamics and Microstructure to Mitigate Overfitting in Pellet Reduction Models. steel research international, 2500263 (2025)
Pauna, H.; Souza Filho, I. R.; Kulse, M.; Jovičević-Klug, M.; Springer, H.; Huttula, M.; Fabritius, T.; Raabe, D.: In Situ Observation of Sustainable Hematite-Magnetite-Wustite-Iron Hydrogen Plasma Reduction. Metallurgical and Materials Transactions B 56 (4), pp. 3938 - 3949 (2025)
Ratzker, B.; Ruffino, M.; Shankar, S.; Raabe, D.; Ma, Y.: Elucidating the microstructure evolution during hydrogen-based direct reduction via a case study of single crystal hematite. Acta Materialia 294, 121174 (2025)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.