Gault, B.: Pushing the analytical limits of atom probe tomography via cryo-enabled workflows. Microscience Microscopy Congress 2021, online, Oxford, UK (2021)
Gault, B.; Guillon, O.: Du térawatt au picomètre: Voyage au cœur des technologies de l’hydrogène. Café des Sciences de l’Ambassade de France en Allemagne, online, Berlin, Germany (2021)
Gault, B.: Advancing corrosion understanding with (cryo-) Atom Probe Tomography. Imperial College London - Rolls Royce corrosion seminar, online, London, UK (2021)
Gault, B.: Machine-Learning for Atom Probe Tomography. Workshop 'Research-data management, machine learning and material informatics for Superalloys', online, Bochum, Germany (2021)
Gault, B.: Introduction to atom probe tomography: performance and opportunities in characterizing microstructures. Metallic Microstructures: European Lectures Online (2021)
Antonov, S.; Shi, R.; Li, D.; Kloenne, Z.; Zheng, Y.; Fraser, H. L.; Raabe, D.; Gault, B.: Atom Probe Tomographic Study of Precursor Metastable Phases and Their Influence on a Precipitation in the Metastable ß-titanium Alloy, Ti–5Al–5Mo–5V–3Cr. TMS 2021 Annual Meeting & Exhibition, online, Pittsburgh, PA, USA (2021)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.