Grundmeier, G.; Fink, N.; Giza, M.; Popova, V.; Vlasak, R.; Wapner, K.: Application of combined spectroscopic, electrochemical and microscopic techniques for the understanding of adhesion and de-adhesion at polymer/metal interfaces. 24. Spektrometertagung, Dortmund, Germany (2005)
Ifeacho, V.: Application of the Chemical Force Microscopy for Analysis of the Molecular Adhesion on α-Al2O3(0001) Interfaces in Aqueous Electrolytes. Dissertation, Universität Paderborn, Paderborn, Germany (2010)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Hydrogen in aluminium can cause embrittlement and critical failure. However, the behaviour of hydrogen in aluminium was not yet understood. Scientists at the Max-Planck-Institut für Eisenforschung were able to locate hydrogen inside aluminium’s microstructure and designed strategies to trap the hydrogen atoms inside the microstructure. This can…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…