Isotta, E.: Investigating microstructure via thermal conductivity imaging: from grain boundaries, to phase segregations and material anisotropy. 50th International Conference and Expo on Advanced Ceramics and Composites (ICACC 2026), Daytona Beach, FL, USA (2026)
Isotta, E.: Investigating microstructure via thermal conductivity imaging: from grain boundaries, to material anisotropy, and phase segregations. Invited Seminar at RWTH Aachen, Physics Department, Aachen, Germany (2025)
Isotta, E.: Thermal conductivity imaging to advance microstructure engineering in thermoelectric and energy materials. Materials Science and Technology Meeting (MSandT) 2025, Columbus, OH, USA (2025)
Isotta, E.; Zhang, S.; Ghosh, S.; de Boor, J.; Balogun, O.; Snyder, G. J.; Scheu, C.: Thermal conductivity imaging to advance microstructure engineering in thermoelectrics. European Conference on Thermoelectrics 2025, Nancy, France (2025)
Isotta, E.: Thermal conductivity imaging to guide microstructure engineering in energy materials. Invited Seminar at the Karlsruhe Institute of Technology, Karlsruhe, Germany (2025)
Isotta, E.: Thermal conductivity imaging to guide microstructure engineering in energy materials. Invited Seminar at the German Aerospace Center in Cologne, Köln, Germany (2025)
Isotta, E.: Thermal conductivity imaging to guide microstructure engineering in energy materials. Iberian Workshop on Thermoelectrics 2025, Castello de la Plana, Spain (2025)
Isotta, E.: Local thermal conductivity imaging and modelling to guide microstructure engineering in energy materials. TMS 2025 Annual Meeting, Las Vegas, NV, USA (2025)
Isotta, E.: Thermal conductivity imaging to guide microstructure engineering in energy materials. Invited Seminar at the Institute of Science and Technology Austria, Klosterneuburg, Austria (2024)
Busch, F.; Balogun, O.; Snyder, G. J.; Scheu, C.; Isotta, E.: Unravelling grain boundary influences on electronic and lattice thermal conductivity in Mn-doped SnTe thermoelectrics. 21st European Conference on Thermoelectrics (ECT) 2025, Nancy, Frankreich (2025)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…