Vlasak, R.; Klueppel, I.; Grundmeier, G.: Combined EIS and FTIR-ATR study of water uptake and diffusion in polymer films on semiconducting electrodes. Electrochim. Acta 52 (28), pp. 8075 - 8080 (2007)
Posner, R.; Giza, G.; Vlasak, R.; Grundmeier, G.: Electrochemical and Spectroscopic Analysis of Ion Transport Processes along Polymer/Oxide/Metal Interfaces in Corrosive and Non-Corrosive Atmosphere. Euradh 2008 - Adhesion '08, St Catherine's College, Oxford, UK (2008)
Grundmeier, G.; Valtiner, M.; Vlasak, R.: Adhesion promoting films and monolayers at polymer/oxide/metal interfaces. NACE2008 RIP Session Coatings and Inhibitors, New Orleans, LA, USA (2008)
Grundmeier, G.; Posner, R.; Vlasak, R.: Combined Spectroscopic and Electrochemical Studies of Water and Ion Transport along Polymer/Oxide/Metal Interphases. ECASIA 2007, 12th European Conference on Applications of Surface and Interface Analysis, Brussels-Flggey, Belgium (2007)
Grundmeier, G.; Fink, N.; Giza, M.; Popova, V.; Vlasak, R.; Wapner, K.: Application of combined spectroscopic, electrochemical and microscopic techniques for the understanding of adhesion and de-adhesion at polymer/metal interfaces. 24. Spektrometertagung, Dortmund, Germany (2005)
Vlasak, R.; Grundmeier, G.: Surface-Enhanced Infrared Spectroscopy of Ultra-Thin Inorganic and Organic Films. 104. Hauptversammlung der Deutschen Bunsen-Gesellschaft für Physikalische Chemie e.V., Frankfurt a. M., Germany (2005)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.