Zambaldi, C.: Primary Recrystallization of a Single-Crystal Ni-Base Superalloy - Experiments and Meso-Scale Modeling. GLADD-Meeting, TU Delft, Delft, The Netherlands (2006)
Zambaldi, C.: Modellierung und experimentelle Untersuchung des Rekristallisationsverhaltens der Nickelbasis-Superlegierung CMSX-4. Kolloquium, University of Bayreuth (2005)
Zambaldi, C.; Zaefferer, S.; Wright, S. I.: Determination of texture and microstructure of ordering domains in gamma-TiAl. Electron Backscatter Diffraction Meeting by the Royal Microscopical Society, University of Sheffield, Sheffield, UK (2008)
Zambaldi, C.; Roters, F.; Bieler, T. R.; Raabe, D.: Micro-mechanical modeling of near-gamma Ti-Al-Nb. 11th World Conference on Titanium (JIMIC5) Ti-2007, Kyoto, Japan (2007)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The thorough, mechanism-based, quantitative understanding of dislocation-grain boundary interactions is a central aim of the Nano- and Micromechanics group of the MPIE [1-8]. For this purpose, we isolate a single defined grain boundary in micron-sized sample. Subsequently, we measure and compare the uniaxial compression properties with respect to…
The goal of this project is the investigation of interplay between the atomic-scale chemistry and the strain rate in affecting the deformation response of Zr-based BMGs. Of special interest are the shear transformation zone nucleation in the elastic regime and the shear band propagation in the plastic regime of BMGs.
In this project we developed a phase-field model capable of describing multi-component and multi-sublattice ordered phases, by directly incorporating the compound energy CALPHAD formalism based on chemical potentials. We investigated the complex compositional pathway for the formation of the η-phase in Al-Zn-Mg-Cu alloys during commercial…
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.