Cojocaru-Mirédin, O.; Schwarz, T.; Choi, P.; Würz, R.; Abou-Ras, D.; Dietrich, J.; Raabe, D.: Exploring the internal interfaces at the atomic-scale in Cu(In,Ga)Se2 thin-films solar cells. 1st EU APT Workshop, CEA/MINATEC, Grenoble, France (2012)
Cojocaru-Mirédin, O.; Choi, P.; Würz, R.; Abou-Ras, D.; Raabe, D.: Study on internal interfaces in CIGS thin-films solar cells using atom probe tomography. 27th EU PVSEC, Frankfurt, Germany (2012)
Schwarz, T.; Cojocaru-Mirédin, O.; Choi, P.; Würz, R.: Atomic-scale analysis of Cu(In,Ga)Se2 grain boundaries. 27th European Photovoltaic Solar Energy Conference and Exhibition, Frankfurt a. M., Germany (2012)
Schwarz, T.; Cojocaru-Mirédin, O.; Choi, P.; Würz, R.: Study of impurities redistribution inside the cigs absorber layer by atom probe tomography. Photovoltaic Technical Conference - Thin Film & Advanced Silicon Solutions 2012 (PVTC 2012), Aix-en-Provence, France (2012)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.