Schmidt, T.; Balk, T. J.; Dehm, G.; Arzt, E.: Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates. Scripta Materialia 50 (6), pp. 733 - 737 (2004)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this project, we aim to realize an optimal balance among the strength, ductility and soft magnetic properties in soft-magnetic high-entropy alloys. To this end, we introduce a high-volume fraction of coherent and ordered nanoprecipitates into the high-entropy alloy matrix. The good combination of strength and ductility derives from massive solid…