Malyar, N.; Dehm, G.; Kirchlechner, C.: Strain rate dependence of the slip transfer through a penetrable high angle grain boundary in copper. Scripta Materialia 138, pp. 88 - 91 (2017)
Malyar, N.; Micha, J.-S.; Dehm, G.; Kirchlechner, C.: Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions. Acta Materialia 129, pp. 91 - 97 (2017)
Dehm, G.; Malyar, N.; Kirchlechner, C.: Towards probing the barrier strength of grain boundaries for dislocation transmission. Electronic Materials and Applications 2017, Orlando, FL, USA (2017)
Dehm, G.; Malyar, N.; Kirchlechner, C.: Do we understand dislocation transmission through grain boundaries? PICS meeting, Luminy, Marseille, France (2017)
Max Planck team explains dendrite propagation, paving the way for safer and longer-lasting next-generation batteries. They publish their findings in the journal Nature.
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…