Publications of Mohammed Kamran Bhat

Bhat, M. K.; Jung, C.; Evertz, S.; Best, J. P.; Dehm, G.: Overcoming the strength ductility trade off in nanostructured copper alloys. Materials and Design 265, 115963 (2026)

Nutor, R.; Ruffino, M.; Miles, A.; Joshi, Y.; Woods, E.; Kamran Bhat, M.; Jannat, S.; Manzoor, U.; Souza Filho, I. R.; Raabe, D. et al.; Gault, B.: Enabling circularity of copper through nanoscale impurity control. Acta Materialia 297, 121373 (2025)

Jang, K.; Dey, P.; Dutta, B.; Park, H.; Son, J.-H.; Jang, J.-I.; Bhat, M. K.; Jang, H.; Kim, H.; Choi, J. et al.; Zhang, S.; Bueno Villoro, R.; Berkels, B.; Kim, B.; Choi, P.-P.; Oh, M.-W.; Jung, Y. S.; Han, J. W.; Scheu, C.; Jung, C.: Improved thermal stability of NbCoSn half-Heusler compounds via Sb doping-induced complementary point defect evolution. Chemical Engineering Journal 518, 164845 (2025)

Best, J. P.; Kanjilal, A.; Ghafarollahi, A.; Rehman, U.; Tian, C.; Bishara, H.; Bhat, M. K.; Christiansen, L.; Bitzek, E.; Stein, F. et al.; Dehm, G.: Fracture of the C15 CaAl₂ Laves phase at small length scales. Journal of Materials Science 59, pp. 12677 - 12694 (2024)

Bhat, M. K.; Prithiv, T. S.; Langenohl, L.; Best, J. P.; Dehm, G.: Role of Ag segregation on microscale strengthening and slip transmission in an asymmetric Σ5 copper grain boundary. Acta Materialia 255, 119081 (2023)

Best, J. P.; Rehman, U.; Tian, C.; Bishara, H.; Bhat, M. K.; Christiansen, L.; Stein, F.; Dehm, G.: Microscale Fracture Toughness Investigation of the Caal2 C15 Laves Phase. SSRN Conference Paper Series, (2023)

Bhat, M. K.; Brink, T.; Ding, H.; Jung, C.; Best, J. P.; Dehm, G.: Influence of the Structure and Chemistry of Σ5 Grain Boundaries on Microscale Strengthening in Cu Bicrystals. TMS Annual Meeting and Exhibition 2024, Orlando, FL, USA (2024)

Brink, T.; Bhat, M. K.; Best, J. P.; Dehm, G.: Grain-boundary segregation effects on bicrystal Cu pillar compression. DPG Spring Meeting, Dresden, Germany (2023)

Bhat, M. K.; Frommeyer, L.; Prithiv, T. S.; Dehm, G.; Best, J. P.: Segregation-induced microscale strengthening of an asymmetric Σ5 grain boundary in Cu doped with Ag. Nanobrücken 2022, Prague, Czech Republic (2022)

Kanjilal, A.; Bhat, M. K.; Duarte, M. J.; Shashkov, P.; Usov, S.; Fanicchia, F.; Beucher, L.; Busch, H.; Scheu, C.; Dehm, G.: Investigation of Al₂O₃ coating deposited on Al alloy by electrochemical oxidation for hydrogen permeation barrier applications. SteelyHydrogen Conference, Ghent, Belgium (2025)

Bhat, M. K.; Frommeyer, L.; Prithiv, T. S.; Dehm, G.; Best, J. P.: Using small-scale mechanics to probe the origins of segregation-induced strengthening. Nanomechanical Testing in Materials Research and Development VIII, Split, Croatia (2022)

Bhat, M. K.: Implications of grain boundary structure and chemistry on microscale plasticity in copper. Dissertation, Ruhr-Universität Bochum (2025)