Harzer, T. P.; Duarte, M. J.; Dehm, G.: In-situ TEM isothermal annealing of nanocrystalline supersaturated Cu–Cr thin film alloys. 80th Annual Conference of the DPG and DPG Spring Meeting, Regensburg, Germany (2016)
Jaya, B. N.; Köhler, M.; Schnabel, V.; Raabe, D.; Schneider, J. M.; Kirchlechner, C.; Dehm, G.: Micro-scale fracture behavior of Co based metallic glass thin films. 2016 TMS Annual Meeting and Exhibition Symposium: In Operando Nano- and Micro-mechanical Characterization of Materials with Special Emphasis on In Situ Techniques, Nashville, TN, USA (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Investigation of solid state dewetting phenomena of epitaxial Al thin films on sapphire using electron microscopy. The 16th European Microscopy Congress (EMC 2016), Lyon, France (2016)
Hieke, S. W.; Dehm, G.; Scheu, C.: Solid state dewetting of epitaxial Al thin films on sapphire studied by electron microscopy. Materials Research Society Fall Meeting & Exhibition 2016 (MRS Fall 2016), Boston, MA, USA (2016)
Luo, W.; Kirchlechner, C.; Dehm, G.; Stein, F.: A New Method to Study the Composition Dependence of Mechanical Properties of Laves. MRS Fall Meeting 2016, Boston, MA, USA (2016)
Dehm, G.: Mikromechanik: lokale Einblicke in die mechanischen Eigenschaften von Materialien. Eröffnung des Christian Doppler Labors für
Lebensdauer und Zuverlässigkeit von Grenzflächen in komplexen Mehrlagenstrukturen der Elektronik „RELAB“, Vienna, Austria (2015)
Dehm, G.: New insights into the mechanical behavior of interface controlled metals. Colloquium Materials Modelling, Institut für Materialprüfung, Werkstoffkunde und Festigkeitslehre (IMWF), Universität Stuttgart , Stuttgart, Germany (2015)
Dehm, G.; Imrich, P. J.; Malyar, N.; Kirchlechner, C.: Differences in deformation behavior of bicrystalline Cu micropillars containing different grain boundaries. MS&T 2015 (Materials Science and Technology) meeting, symposium entitled "Deformation and Transitions at Grain Boundaries", Columbus, OH, USA (2015)
Dehm, G.; Zhang, Z.; Völker, B.: Structure and strength of metal-ceramic interfaces: New insights by Cs corrected TEM and advances in miniaturized mechanical testing. MS&T 2015 (Materials Science and Technology) meeting, Symposium entitled "Structures and Properties of Grain Boundaries: Towards an atomic-scale understanding of ceramics", Columbus, OH, USA (2015)
Dehm, G.; Harzer, T. P.; Völker, B.; Imrich, P. J.; Zhang, Z.: Towards New Insights on Interface Controlled Materials by Advanced Electron Microscopy. Frontiers of Electron Microscopy in Materials Science Meeting (FEMMS 2015), Lake Tahoe, CA, USA (2015)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…
Here the focus lies on investigating the temperature dependent fracture of materials down to the individual microstructural length-scales, such as respective phases, grain/phase boundaries or hetero-interfaces, to understand brittle-ductile transitions in deformation and the role of chemistry or crystallography on it.
In this project we work on correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. The task is to image the boron segregation at grain boundaries in the Co-9Al-9W-0.005B alloy.