Polin, N.; Giron, S.; Adabifiroozjaei, E.; Yang, Y.; Saxena, A.; Gutfleisch, O.; Gault, B.: Atomic‐scale insights to design of high‐performing SmCo based sintered permanent magnets gained by atom probe tomography. 12th International Conference on Magnetic and Superconducting Materials (MSM22), Duisburg, Germany (2022)
Gault, B.: Pushing the analytical limits of atom probe tomography via cryo-enabled workflows. Microscience Microscopy Congress 2021, online, Oxford, UK (2021)
Gault, B.; Guillon, O.: Du térawatt au picomètre: Voyage au cœur des technologies de l’hydrogène. Café des Sciences de l’Ambassade de France en Allemagne, online, Berlin, Germany (2021)
Gault, B.: Advancing corrosion understanding with (cryo-) Atom Probe Tomography. Imperial College London - Rolls Royce corrosion seminar, online, London, UK (2021)
Gault, B.: Machine-Learning for Atom Probe Tomography. Workshop 'Research-data management, machine learning and material informatics for Superalloys', online, Bochum, Germany (2021)
Gault, B.: Introduction to atom probe tomography: performance and opportunities in characterizing microstructures. Metallic Microstructures: European Lectures Online (2021)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…