Khorashadizadeh, A.; Winning, M.; Zaefferer, S.; Raabe, D.: Recrystallization and grain growth in ultra fine grained CuZr alloy processed by high pressure torsion. Materials Science and Engineering MSE 2010, Darmstadt, Germany (2010)
Winning, M.; Khorashadizadeh, A.; Raabe, D.: Characterization of the microstructure of ultra fine-grained materials processed by severe plastic deformation methods in the deformed and the annealed state. Materials Science and Engineering MSE 2010, Darmstadt, Germany (2010)
Winning, M.; Raabe, D.: Fast, physically-based algorithms for on-line calculations of texture and anisotropy during fabrication of steel sheets. Materials Science and Engineering MSE 2010, Darmstadt, Germany (2010)
Winning, M.; Khorashadizadeh, A.; Raabe, D.; Zaefferer, S.: Recrystallization and grain growth in ultra fine grained materials produced by high pressure torsion. Recrystallization & Grain Growth 4 RX&GG, Sheffield, UK (2010)
Uyar, F.; Wilson, S.; Winning, M.; Rollett, A. D.: Interface Texture Evolution During Grain Growth Under the Effect of Stress. Recrystallization & Grain Growth 4 RX&GG, Sheffield, UK (2010)
Uyar, F.; Gruber, J.; Lee, S.; Winning, M.; Rollett, A. D.: Stagnation of Thin Film Grain Growth under the Effect of a Stress Field. Materials Science & Technology 2009 Conference, Pittsburgh, PA, USA (2009)
Khorashadizadeh, A.; Winning, M.; Raabe, D.: Microstructure and Texture evolution during high pressure torsion of a CuZr alloy. Euromat 2009, Glasgow, UK (2009)
Khorashadizadeh, A.; Winning, M.; Raabe, D.: Microstructure and Texture evolution during high pressure torsion of a CuZr alloy. 15th International Conference on the Strength of Materials ICSMA 2009, Dresden, Germany (2009)
Khorashadizadeh, A.; Winning, M.; Zaefferer, S.; Raabe, D.: 3D tomographic EBSD characterization of crystal topology in a CuZr alloy processed by equal channel angular pressing. Interdisciplinary Symposium on 3D Microscopy, Interlaken, Switzerland (2009)
Khorashadizadeh, A.; Raabe, D.; Winning, M.: Microstructure and texture evolution during high pressure torsion of a Cu0.17wt%Zr alloy. DPG Frühjahrstagung 2009, Dresden, Germany (2009)
Schulz, S.; Winning, M.; Raabe, D.: A modified cellular automaton for the simulation of recrystallization in aluminum. ICAA 11 - International Conference on Aluminium Alloys 2008, Aachen, Germany (2008)
Khorashadizadeh, A.; Raabe, D.; Winning, M.: Three-dimensional tomographic EBSD measurements of the crystal topology in heavily deformed ultra fine grained pure Cu and Cu-0.17wt%Zr obtained from ECAP and HPT. 4th International Conference on Nanomaterials by Severe Plastic Deformation nanoSPD 4, Goslar, Germany (2008)
Brahme, A.; Winning, M.; Raabe, D.: Texture Component Model for Predicting Recrystallization Textures. 15th International Conference on the Texture of Materials (ICOTOM 15), Pittsburgh, PA, USA (2008)
Winning, M.; Raabe, D.: Influence of Grain Boundary Mobility on Texture Evolution during Recrystallization. 15 th International Conference on the Texture of Materials (ICOTOM 15), Pittsburgh, PA, USA (2008)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The aim of the work is to develop instrumentation, methodology and protocols to extract the dynamic strength and hardness of micro-/nano- scale materials at high strain rates using an in situ nanomechanical tester capable of indentation up to constant strain rates of up to 100000 s−1.
This project deals with the phase quantification by nanoindentation and electron back scattered diffraction (EBSD), as well as a detailed analysis of the micromechanical compression behaviour, to understand deformation processes within an industrial produced complex bainitic microstructure.
Within this project, we will use an infra-red laser beam source based selective powder melting to fabricate copper alloy (CuCrZr) architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional CuCrZr alloy lattice architectures, under both quasi-static and dynamic loading…
Copper is widely used in micro- and nanoelectronics devices as interconnects and conductive layers due to good electric and mechanical properties. But especially the mechanical properties degrade significantly at elevated temperatures during operating conditions due to segregation of contamination elements to the grain boundaries where they cause…