Oellers, T.; Arigela, V. G.; Kirchlechner, C.; Pfetzing-Micklich, J.; Dehm, G.; Ludwig, A.: Combinatorial synthesis and characterization of binary Cu–Ag alloys in the form of microstructured thin films [Kombinatorische Synthese und Charakterisierung binärer Cu–Ag Legierungen in Form mikrostrukturierter dünner Schichten]. Metall 72 (11), p. 429 (2018)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: High temperature mechanical characterization of binary Cu–X alloys produced by Combinatorial Synthesis. International conference on metallurgical coatings and thin films (ICMCTF) 2019, San Diego, CA, USA (2019)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: High temperature mechanical characterization of Copper-Silver- and Copper-Zirconium thin film libraries produced by combinatorial materials synthesis approach. Gordon Research Seminar on Thin Film and Small Scale Mechanical Behavior (GRS) 2018, Lewiston, ME, USA (2018)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: Mechanical characterization of copper thin films produced by photolithography with a novel microscale high temperature loading rig. The International Conference on Experimental Mechanics, (ICEM) 2018, Brussels, Belgium (2018)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: Setup of a microscale high temperature loading rig for micro-fracture mechanics with a novel temperature measurement approach. Advanced nano-mechanical techniques for academic and industrial research, Aachen, Germany (2018)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: Temperature dependent mechanical characterization of sputtered Copper-Silver thin film tensile specimens produced by photolithography. Materials Chain International Conference, Bochum, Germany, Bochum, Germany (2018)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: High temperature mechanical characterization of Copper-Silver- and Copper-Zirconium thin film libraries produced by combinatorial materials synthesis approach. GDRi Mecano General School 2018, Cargese, Corsica, France (2018)
Arigela, V. G.; Oellers, T.; Ludwig, A.; Kirchlechner, C.; Dehm, G.: High temperature mechanical characterization of Copper-Silver- and Copper-Zirconium thin film libraries produced by combinatorial materials synthesis approach. Gordon Research Seminar on Thin Film and Small Scale Mechanical Behavior (GRS) 2018, Lewiston, ME, USA (2018)
Oellers, T.: Development of combinatorial methods to tailor electrical and mechanical properties of Cu-based thin-film structures. Dissertation, Ruhr-Universität Bochum (2022)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
The full potential of energy materials can only be exploited if the interplay between mechanics and chemistry at the interfaces is well known. This leads to more sustainable and efficient energy solutions.
This project is part of Correlative atomic structural and compositional investigations on Co and CoNi-based superalloys as a part of SFB/Transregio 103 project “Superalloy Single Crystals”. This project deals with the identifying the local atomic diffusional mechanisms occurring during creep of new Co and Co/Ni based superalloys by correlative…
This study investigates the mechanical properties of liquid-encapsulated metallic microstructures created using a localized electrodeposition method. By encapsulating liquid within the complex metal microstructures, we explore how the liquid influences compressive and vibrational characteristics, particularly under varying temperatures and strain…
In this project, we investigate a high angle grain boundary in elemental copper on the atomic scale which shows an alternating pattern of two different grain boundary phases. This work provides unprecedented views into the intrinsic mechanisms of GB phase transitions in simple elemental metals and opens entirely novel possibilities to kinetically engineer interfacial properties.