Kim, Y.-J.; Kim, H.; Kang, M.; Rhee, K.; Shin, S. Y.; Lee, S.: Correlation of microstructure, chip-forming properties, and dynamic torsional properties in free-machining steels. Metallurgical and Materials Transactions A 44 (10), pp. 4613 - 4625 (2013)
Shin, S. Y.: Effects of microstructure on tensile, charpy impact, and crack tip opening displacement properties of two API X80 pipeline steels. Metallurgical and Materials Transactions A 44 (6), pp. 2613 - 2624 (2013)
Sohn, S. S.; Han, S. Y.; Shin, S. Y.; Bae, J.; Lee, S.: Effects of microstructure and pre-strain on Bauschinger effect in API X70 and X80 linepipe steels. Metals and Materials International 19 (3), pp. 423 - 431 (2013)
Sohn, S. S.; Han, S. Y.; Shin, S. Y.; Bae, J.; Lee, S.: Analysis and estimation of the yield strength of API X70 and X80 linepipe steels by double-cycle simulation tests. Metals and Materials International 19 (3), pp. 377 - 388 (2013)
Kim, H.; Kang, M.; Shin, S. Y.; Lee, S.: Alligatoring phenomenon occurring during hot rolling of free-machining steel wire rods. Materials Science and Engineering A: Structural Materials Properties Microstructure and Processing 568, pp. 8 - 19 (2013)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.