Wang, Z.; Gu, J.; An, D.; Liu, Y.; Song, M.: Characterization of the microstructure and deformation substructure evolution in a hierarchal high-entropy alloy by correlative EBSD and ECCI. Intermetallics 121, 106788 (2020)
An, X.; Wang, Z.; Ni, S.; Song, M.: The tension-compression asymmetry of martensite phase transformation in a metastable Fe40Co20Cr20Mn10Ni10 high-entropy alloy. Science China Materials 63 (9), pp. 1797 - 1807 (2020)
Wang, Z.; Lu, W.; Raabe, D.; Li, Z.: On the mechanism of extraordinary strain hardening in an interstitial high-entropy alloy under cryogenic conditions. Journal of Alloys and Compounds 781, pp. 734 - 743 (2019)
Li, Z.; Su, J.; Lu, W.; Wang, Z.; Raabe, D.: Metastable high-entropy alloys: design, structure and properties. 2nd International Conference on High-Entropy Materials (ICHEM 2018), Jeju, South Korea (2018)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
This project aims to investigate the influence of grain boundaries on mechanical behavior at ultra-high strain rates and low temperatures. For this micropillar compressions on copper bi-crystals containing different grain boundaries will be performed.
The objective of the project is to investigate grain boundary precipitation in comparison to bulk precipitation in a model Al-Zn-Mg-Cu alloy during aging.
This project aims to develop a testing methodology for the nano-scale samples inside an SEM using a high-speed nanomechanical low-load sensor (nano-Newton load resolution) and high-speed dark-field differential phase contrast imaging-based scanning transmission electron microscopy (STEM) sensor.
The thorough, mechanism-based, quantitative understanding of dislocation-grain boundary interactions is a central aim of the Nano- and Micromechanics group of the MPIE [1-8]. For this purpose, we isolate a single defined grain boundary in micron-sized sample. Subsequently, we measure and compare the uniaxial compression properties with respect to…