Djaziri, S.; Li, Y.; Goto, S.; Kirchlechner, C.; Raabe, D.; Dehm, G.: Microstructural characterization of cold-drawn pearlitic steel wires at the nanometer scale. The Thin Film & Small Scale Mechanical Behavior Gordon Research Conference, Waltham, MA, USA (2014)
Fink, C.; Brinckmann, S.; Dehm, G.: Nanotribology and Microstructure Evolution in Pearlite. 3rd European Symposium on Friction, Wear and Wear Protection, Karlsruhe, Germany (2014)
Malyar, N.; Dehm, G.; Kirchlechner, C.: Dislocation motion in bi-crystals with a specific grain boundary orientation studied by in situ SEM and in situ µLaue diffraction. Conference: Thin Film & Small Scale Mechanical Behavior Gordon Research , Waltham, MA, USA (2014)
Malyar, N.; Dehm, G.; Kirchlechner, C.: Dislocation motion in bi-crystals with a specific grain boundary orientation studied by in situ SEM and in situ µLaue diffraction. Seminar: Thin Film & Small Scale Mechanical Behavior Gordon Research , Waltham, MA, USA (2014)
Philippi, B.; Kirchlechner, C.; Schießl, A.; Schingale, A.; Dehm, G.: Improving lead-free solders by resolving mechanical properties at the microstructure length scale. Thin Film & Small Scale Mechanical Behavior 2014, Gordon Research Conference, Waltham, MA, USA (2014)
Jaya, B. N.; Kirchlechner, C.; Dehm, G.: Fracture behavior of gradient PtNiAl bond coats at the micron-scale using in-situ microbeam bend studies. 13th European Nanomechanical User Group Meeting, Oxford, UK (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Deformation behavior of thin Cu/Cr films on polyimide. Small Scale Plasticity School, Cargèse, Corsica, France (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion behavior of Cu–Cr thin films on polyimide substrate. ECI Conference "Nano- and Micro-Mechanical Testing in Materials Research and Development IV", Olhão, Portugal (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints in automotive microelectronics. GDRi CNRS MECANO General Meeting on the Mechanics of Nano-Objects, MPIE, Düsseldorf, Germany (2013)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Cordill, M. J.; Dehm, G.: Adhesion Behavior of Cu–Cr Thin Films on Polyimide Substrate. TMS 2013: 142nd Annual Meeting & Exhibition, San Antonio, TX, USA (2013)
Philippi, B.; Schießl, A.; Schingale, A.; Dehm, G.: Micromechanical investigation of solder joints for automotive microelectronics. Nano- and Micromechanical Testing in Materials Research and Development IV, Olhão Algarve, Portugal (2013)
Harzer, T. P.; Dehm, G.: Microstructural studies of Cu–Cr thin film structures grown by molecular beam epitaxy using advanced transmission electron microscopy. Macan Theromodynamics Workshop, Istanbul, Turkey (2012)
Marx, V. M.; Kirchlechner, C.; Zizak, I.; Dehm, G.; Cordill, M. J.: In-situ fracture study of thin Cu films on polyimide substrate. GDRi MECANO General Meeting 2012, Ecole de Mines, Paris, France (2012)
Eiper, E.; Martinschitz, K. J.; Dehm, G.; Kečkéš, J.: Size effect in metallic thin films characterized by low-temperature X-ray diffraction. Gordon Research Conference on thin film & smallscale mechanical behavior , Colby College Waterville, Maine, USA (2006)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Smaller is stronger” is well known in micromechanics, but the properties far from the quasi-static regime and the nominal temperatures remain unexplored. This research will bridge this gap on how materials behave under the extreme conditions of strain rate and temperature, to enhance fundamental understanding of their deformation mechanisms. The…
In this project, we aim to realize an optimal balance among the strength, ductility and soft magnetic properties in soft-magnetic high-entropy alloys. To this end, we introduce a high-volume fraction of coherent and ordered nanoprecipitates into the high-entropy alloy matrix. The good combination of strength and ductility derives from massive solid…