Grundmeier, G.; Fink, N.; Giza, M.; Popova, V.; Vlasak, R.; Wapner, K.: Application of combined spectroscopic, electrochemical and microscopic techniques for the understanding of adhesion and de-adhesion at polymer/metal interfaces. 24. Spektrometertagung, Dortmund, Germany (2005)
Grundmeier, G.; Wapner, K.: Anwendung einer neuen höhenregulierbaren Rasterkelvinsonde zur Untersuchung der Stabilität von Klebstoff-Metall-Grenzflächen in feuchten und korrosiven Atmosphären. Swissbonding, Rapperswil am Zürichsee, Switzerland (2005)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Fundamentals and Applications of a new height regulated Scanning Kelvin Probe in Corrosion and Adhesion Science. ISE 2004, Thessaloniki, Greece (2004)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Introduction of a height regulated Scanning Kelvin Probe for the simultaneous measurement of surface topography and interfacial electrode potentials in corrosive environments. ISE Conference, 55th Annual Meeting, Thessaloniki, Greece (2004)
Grundmeier, G.; Wapner, K.: Water diffusion measurements in a model adhesive/silicon lap joint using FTIR-spectroscopy: Differentiation between bulk and interfacial diffusion. Euradh 2004, Freiburg, Germany (2004)
Wapner, K.; Grundmeier, G.: Extended Abstract: Water diffusion measurements in a model adhesive/silicon lap joint using FTIR-spectroscopy: differentiation between bulk and interfacial diffusion. Euradh2004/Adhesion2004, Freiburg, Germany (2004)
Wapner, K.; Stratmann, M.; Grundmeier, G.: Extended Abstract: Non-destructive, in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new scanning Kelvin probe blister Test. Euradh2004/Adhesion2004, Freiburg, Germany (2004)
Grundmeier, G.; Wapner, K.; Stratmann, M.: Applications of a new height regulated Scanning Kelvin Probe for the study of polymer/metal interfaces in corrosive environments. ICEPAM 2004, Helsinki, Finnland (2004)
Grundmeier, G.; Wapner, K.; Schönberger, B.; Stratmann, M.: Non-destructive, real time in-situ measurement of de-adhesion processes at buried adhesive/metal interfaces by means of a new Scanning Kelvin Probe Blister Test. Annual Meeting of the American Adhesion Society, Wilmington, UK (2004)
Wapner, K.; Grundmeier, G.: Application of the Scanning Kelvin Probe for the study of de-adhesion processes at thin film engineered adhesive/metal interfaces. Annual Meeting of the American Adhesion Society, Wilmington, UK (2004)
Posner, R.; Wapner, K.; Stratmann, M.; Grundmeier, G.: Hydrated Ion Transport at Polymer/Oxide/Metal-Interfaces in Non-Corrosive Atmosphere: Influence of Electric Field Gradients. Gordon Conference Graduate Research Seminar on Aqueous Corrosion, Colby Sawyer College, New London, NH, USA (2008)
Klimow, G.; Wapner, K.; Grundmeier, G.: Applications of a Scanning Kelvin Probe for Studying Modified Adhesive/Metal Interfaces under Corrosive and Mechanical Load. 3rd World Congress on Adhesion and Related Phenomena, WCARP-III, Beijing, China (2006)
Wapner, K.; Stratmann, M.; Grundmeier, G.: Non-destructive, In-Situ Measurement of De-Adhesion Processes at Buried Adhesive/Metal Interfaces by Means of a New Scanning Kelvin Probe Blister Test. EUROMAT 2005, Prague, Czech Republic (2005)
Wapner, K.; Stratmann, M.; Grundmeier, G.: The application of the scanning Kelvin probe for investigating the deadhesion of adhesives on iron and zinc. EURADH 2002, Glasgow, UK (2002)
Wapner, K.: Grenzflächenchemische und elektrochemische Untersuchungen zur Haftung und Enthaftung an modifizierten Klebstoff/Metall-Grenzflächen. Dissertation, Ruhr-Universität Bochum, Fakultät für Chemie, Bochum, Germany (2006)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
In this ongoing project, we investigate spinodal fluctuations at crystal defects such as grain boundaries and dislocations in Fe-Mn alloys using atom probe tomography, electron microscopy and thermodynamic modeling [1,2].
The aim of the Additive micromanufacturing (AMMicro) project is to fabricate advanced multimaterial/multiphase MEMS devices with superior impact-resistance and self-damage sensing mechanisms.
TiAl-based alloys currently mature into application. Sufficient strength at high temperatures and ductility at ambient temperatures are crucial issues for these novel light-weight materials. By generation of two-phase lamellar TiAl + Ti3Al microstructures, these issues can be successfully solved. Because oxidation resistance at high temperatures is…
We will investigate the electrothermomechanical response of individual metallic nanowires as a function of microstructural interfaces from the growth processes. This will be accomplished using in situ SEM 4-point probe-based electrical resistivity measurements and 2-point probe-based impedance measurements, as a function of mechanical strain and…