Vlasak, R.; Klueppel, I.; Grundmeier, G.: Combined EIS and FTIR-ATR study of water uptake and diffusion in polymer films on semiconducting electrodes. Electrochim. Acta 52 (28), pp. 8075 - 8080 (2007)
Posner, R.; Giza, G.; Vlasak, R.; Grundmeier, G.: Electrochemical and Spectroscopic Analysis of Ion Transport Processes along Polymer/Oxide/Metal Interfaces in Corrosive and Non-Corrosive Atmosphere. Euradh 2008 - Adhesion '08, St Catherine's College, Oxford, UK (2008)
Grundmeier, G.; Valtiner, M.; Vlasak, R.: Adhesion promoting films and monolayers at polymer/oxide/metal interfaces. NACE2008 RIP Session Coatings and Inhibitors, New Orleans, LA, USA (2008)
Grundmeier, G.; Posner, R.; Vlasak, R.: Combined Spectroscopic and Electrochemical Studies of Water and Ion Transport along Polymer/Oxide/Metal Interphases. ECASIA 2007, 12th European Conference on Applications of Surface and Interface Analysis, Brussels-Flggey, Belgium (2007)
Grundmeier, G.; Fink, N.; Giza, M.; Popova, V.; Vlasak, R.; Wapner, K.: Application of combined spectroscopic, electrochemical and microscopic techniques for the understanding of adhesion and de-adhesion at polymer/metal interfaces. 24. Spektrometertagung, Dortmund, Germany (2005)
Vlasak, R.; Grundmeier, G.: Surface-Enhanced Infrared Spectroscopy of Ultra-Thin Inorganic and Organic Films. 104. Hauptversammlung der Deutschen Bunsen-Gesellschaft für Physikalische Chemie e.V., Frankfurt a. M., Germany (2005)
International researcher team presents a novel microstructure design strategy for lean medium-manganese steels with optimized properties in the journal Science
Within this project, we will use a green laser beam source based selective melting to fabricate full dense copper architectures. The focus will be on identifying the process parameter-microstructure-mechanical property relationships in 3-dimensional copper lattice architectures, under both quasi-static and dynamic loading conditions.
Oxides find broad applications as catalysts or in electronic components, however are generally brittle materials where dislocations are difficult to activate in the covalent rigid lattice. Here, the link between plasticity and fracture is critical for wide-scale application of functional oxide materials.
The fracture toughness of AuXSnY intermetallic compounds is measured as it is crucial for the reliability of electronic chips in industrial applications.
Within this project we investigate chemical fluctuations at the nanometre scale in polycrystalline Cu(In,Ga)Se2 and CuInS2 thin-flims used as absorber material in solar cells.